Wafer Solder Bumping

Wafer bumping is a key part of the supply chain for many of the Flip Chip devices Samtec Microelectronics manufactures, and there are several options available. When you’re ready for Flip Chip, Samtec Micro can assist in choosing the perfect bump technology and materials to meet your requirements, whether offered by the wafer fab or through one of our suppliers.

Standard processes available:

UBM (Under Bump Metallization)

Electroless Ni/Immersion Au plating (lower cost) 2” to 12” Wafers
Ni/Pd/Au for wirebond pad resurfacing

Bumping

Wafer and die level stencil printed solder bumping
Gang Ball Placement / Solderball drop
Solder Ball SB2 Jet
Micro-Solder Ball Attach
Gold Stud Bumps

Materials

Eutectic PbSn (37/63)
High lead (90/10)
Lead free (SnAgCu) solder bumps
Solder Ball SB2 Jet (eut.SnPb, SnAgCu, AuSn, InSn)

Whether your device requires three bumps or 3,000, has single or multiple die, requires lead-free, eutectic, or Stud Bumps, Samtec Micro can provide a turn-key bumping and assembly solution for you as it has many other recognizable industry names for more than 10 years!

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