Complete Turn-Key Production
Organic (incl. BT), ceramic, or metal substrates - All body sizes & configurations
Substrate design & acquisition, or
Assembly of customer-supplied substrates
High performance substrates available
Low & medium volume production
Quick-turn prototypes in 8 hours
Materials selection & evaluation
ITAR Compliance available
Wirebond or Flip Chip
Finest-pitch wirebonding (< 35 µM)
Ultra-high wire counts
Wafer-bumping services (FC)
Dam & fill encapsulation (WB)
Underfill & lid (FC)
Open cavity or removable lid (WB)
Eutectic & High Pb
All ball sizes
Mil Std permanency
Up to 300mm wafers
Thin wafers & narrow streets
Die and wafer tracing available
Wafer backgrind available
Samtec Microelectronics is a preferred on-shore supplier of wirebond and Flip Chip PBGA & CBGA devices. By design, BGAs maximize the performance of today’s silicon, but they also require the most advanced assembly equipment & processes available. Samtec Microelectronics has the latest equipment & the engineering depth to help bring your BGA products to market quickly & with unsurpassed quality!
Whether you need 50 or 50,000 devices, Samtec Micro can assemble your substrates in singulated or strip form, or we can work closely with you to provide a full turn-key solution; from the design of standard or high-performance substrates with multiple power & grounds for enhanced performance, to shipment of completed devices.
With advance preparation, prototypes of your first silicon can often be made in just 8 hours, & Samtec Micro can ship fully-encapsulated devices or parts with removable lids for additional die processing or probing.
There’s a reason why some of the world’s most recognizable names in electronics depend on Samtec Microelectronics for their BGA assembly needs. Let Samtec Micro leverage these same capabilities for your critical BGA projects!