Organic (incl. BT), ceramic, or metal substrates - All body sizes & configurations
Substrate design & acquisition, or
Assembly of customer-supplied substrates
High performance substrates available
Low & medium volume production
Quick-turn prototypes in 8 hours
Materials selection & evaluation
Reliability testing
Inventory management
ITAR Compliance available

Finest-pitch wirebonding (< 35 µM)
Ultra-high wire counts
Stacked die
Wafer-bumping services (FC)

Dam & fill encapsulation (WB)
Underfill & lid (FC)
Open cavity or removable lid (WB)

Eutectic & High Pb
Pb-Free (RoHS)
All ball sizes

Custom marking
Mil Std permanency
Serialization available

Up to 300mm wafers
Thin wafers & narrow streets
Die and wafer tracing available
Wafer backgrind available

BGA Assembly

Aspen Technologies is a preferred on-shore supplier of wirebond and Flip Chip PBGA & CBGA devices. By design, BGAs maximize the performance of today’s silicon, but they also require the most advanced assembly equipment & processes available. Aspen Technologies has the latest equipment & the engineering depth to help bring your BGA products to market quickly & with unsurpassed quality!

Whether you need 50 or 50,000 devices, Aspen can assemble your substrates in singulated or strip form, or we can work closely with you to provide a full turn-key solution; from the design of standard or high-performance substrates with multiple power & grounds for enhanced performance, to shipment of completed devices.

With advance preparation, prototypes of your first silicon can often be made in just 8 hours, & Aspen can ship fully-encapsulated devices or parts with removable lids for additional die processing or probing.

There’s a reason why some of the world’s most recognizable names in electronics depend on Aspen Technologies for their BGA assembly needs. Let Aspen leverage these same capabilities for your critical BGA projects!